TY  - BOOK
T1  - Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications
A2  - Hakim, Edward B.
A2  - Nguyen, Luu T.
A2  - Pecht, Michael
LA  - English
PP  - New York
PB  - Wiley
YR  - 1995
UL  - https://ds.mainlib.upd.edu.ph/Record/UP-99796217602968641
OP  - 474
NO  - "A Wiley-Interscience publication."
CN  - TK 7874 P63
SN  - 0471306258
KW  - Microelectronic packaging : Materials.
KW  - Microencapsulation.
KW  - Plastics in packaging.
ER  -