Fan-out wafer-level packaging

Bibliographic Details
Main Author:	Lau, John H. (Author)
Corporate Author:	SpringerLink (Online service)
Format:	Electronic Resource
Language:	English
Published:	Singapore Springer Singapore [2018]
Subjects:	Systems engineering. Engineering. Optical materials. Electronic books.
Online Access:	Available for University of the Philippines System via SpringerLink. Click here to access Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy