Výsledky vyhledávání

Principles of electronic packaging

Circuits, interconnections, and packaging for VLSI Autor Bakoglu, H. B. 1958-

The handbook of machine soldering SMT and TH. Autor Woodgate, Ralph W. 1922-

High temperature electronics

Electronic packaging design, materials, process, and reliability

Manufacturing processes and materials challenges in microelectronic packaging presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georg...

Chip on board technologies for multichip modules

Physical architecture of VLSI systems

Adhesives technology for electronic applications materials, processing, reliability Autor Licari, James J. 1930-

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The basics of soldering Autor Rahn, Armin