检索结果

Principles of electronic packaging

Circuits, interconnections, and packaging for VLSI 由 Bakoglu, H. B. 1958-

The handbook of machine soldering SMT and TH. 由 Woodgate, Ralph W. 1922-

High temperature electronics

Electronic packaging design, materials, process, and reliability

Manufacturing processes and materials challenges in microelectronic packaging presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georg...

Chip on board technologies for multichip modules

Physical architecture of VLSI systems

Adhesives technology for electronic applications materials, processing, reliability 由 Licari, James J. 1930-

Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy

The basics of soldering 由 Rahn, Armin