نتائج البحث

Chip scale package (CSP) design, materials, processes, reliability, and applications حسب Lau, John H.

Multichip module technology handbook حسب Garrou, Philip E.

MEMS & microsystems design and manufacture حسب Hsu, Tai-Ran

Manufacturing processes and materials challenges in microelectronic packaging presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georg...

Advanced MEMS packaging

Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access

Introduction to system-on-package (SOP) miniaturization of the entire system حسب Tummala, Rao R. 1942-

Table of contents only

Quantum-well laser array packaging nanoscale packaging techniques

Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access thru Remote Access via EZProxy

MEMS/MOEMS packaging concepts, designs, materials, and processes حسب Gilleo, Ken

Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access thru Remote Access via EZProxy

Thermal stress and strain in microelectronics packaging

Microelectronic system interconnections performance and modeling