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Chip scale package (CSP) design, materials, processes, reliability, and applications Autor Lau, John H.

Multichip module technology handbook Autor Garrou, Philip E.

MEMS & microsystems design and manufacture Autor Hsu, Tai-Ran

Manufacturing processes and materials challenges in microelectronic packaging presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georg...

Advanced MEMS packaging

Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access

Introduction to system-on-package (SOP) miniaturization of the entire system Autor Tummala, Rao R. 1942-

Table of contents only

Quantum-well laser array packaging nanoscale packaging techniques

Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access thru Remote Access via EZProxy

MEMS/MOEMS packaging concepts, designs, materials, and processes Autor Gilleo, Ken

Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access thru Remote Access via EZProxy

Thermal stress and strain in microelectronics packaging

Microelectronic system interconnections performance and modeling