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Chip scale package (CSP) design, materials, processes, reliability, and applications 著者: Lau, John H.

Multichip module technology handbook 著者: Garrou, Philip E.

MEMS & microsystems design and manufacture 著者: Hsu, Tai-Ran

Manufacturing processes and materials challenges in microelectronic packaging presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georg...

Advanced MEMS packaging

Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access

Introduction to system-on-package (SOP) miniaturization of the entire system 著者: Tummala, Rao R. 1942-

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Quantum-well laser array packaging nanoscale packaging techniques

Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access thru Remote Access via EZProxy

MEMS/MOEMS packaging concepts, designs, materials, and processes 著者: Gilleo, Ken

Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access thru Remote Access via EZProxy

Thermal stress and strain in microelectronics packaging

Microelectronic system interconnections performance and modeling