Diffusion bonding 2

Diffusion bonding 2

Bibliographic Details
Corporate Author: International Conference on Diffusion Bonding Cranfield Institute of Technology
Other Authors: Stephenson, D.J
Format: Book
Language:English
Published: London Elsevier Applied Science 1991.
Subjects:
Aluminum alloys > Bonding > Congresses.
Diffusion bonding (Metals) > Congresses.
Heat resistant materials > Congresses.