Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Bibliographic Details
Main Author: Tong, Xingcun Colin
Corporate Author: SpringerLink (Online service)
Format: Electronic Resource
Language:English
Published: New York, NY Springer New York 2011.
Series:Springer series in advanced microelectronics 30
Subjects:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
Online Access:Available for University of the Philippines Diliman via SpringerLink. Click here to access